Heat Sinks

Passive cooling components that dissipate heat from electronic devices (e.g., CPUs, power transistors) through conduction and convection.

• Material: Aluminum (common), Copper (higher conductivity)
• Fins: Increase surface area for better thermal dissipation
• Thermal Interface Material (TIM): Used between component and heatsink (e.g., thermal paste, pads)
• Mounting: Clips, screws, or adhesives
• Selection Criteria: Thermal resistance (°C/W), size, airflow, power dissipation

Note: Often used with fans for active cooling in high-power applications.